Low-Pressure PlasmaPlasma system Tetra 640
Modular plasma system for industrial processes
The Tetra 640 low-pressure plasma system has been developed for industrial applications that require a large chamber volume and a high degree of adaptability. With a chamber volume of 640 litres and a modular vacuum chamber system, the plant can be flexibly configured to suit different workpiece sizes and process requirements.
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Modular plasma system for growing production requirements
With a chamber volume of 640 litres, the Tetra 640 plasma system is suitable for both large individual components and the cost-effective treatment of multiple workpieces within a single process cycle. The modular vacuum chamber system allows for customisation to suit different component sizes and future production requirements. The modular design ensures investment security and enables long-term use even as requirements increase.
Depending on the configuration, various PC control systems are available – ranging from standardised process sequences to full PC control with process archiving, alarm management and optional MES integration. This allows all process parameters to be documented and controlled in a reproducible manner.
The Tetra 640 helps companies to reliably prepare surfaces for subsequent processes such as bonding, coating, painting or printing.
Cleaning
The Low-Pressure Plasma system Tetra 640 offers solutions for ultra-precise cleaning of all surfaces, for every substrate, and for every post-treatment process. Plasma cleaning removes all organic residues without subjecting the component to chemical or thermal stress.
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Activation
Good surface wettability is a prerequisite for the adhesion of bonding partners during painting, gluing, printing, or bonding. Plasma activation using the Low-Pressure Plasma Tetra 640 system creates polar bonding partners and increases the surface energy.
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Coating
The Low-Pressure Plasma Tetra 640 system can also modify surfaces by applying a coating. Plasma coating can be used to deposit hydrophobic, hydrophilic, protective, or insulating layers of any kind.
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Etching
The plasma technology of the Low-Pressure Plasma Tetra 640 system enables anisotropic and isotropic etching. This results in the nanostructuring of surfaces, which increases their surface area and improves adhesion.
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640l chamber
The Low-Pressure Plasma Tetra 640 system is equipped with a large chamber volume of 640 litres, which is ideally suited to large industrial components. Furthermore, the chamber can be designed to be shorter or deeper in 500 mm increments. An aluminium chamber is available for this purpose, ensuring particularly safe and stable industrial processes. The generous chamber size allows for the simultaneous processing of complex or multiple components, making the Tetra 640 ideally suited for industrial production processes and series applications.
The modular vacuum chamber system enables easy integration into existing production environments.
Electrode
As technology advances, so do the requirements. With Diener electronic, companies benefit from a high level of investment security, as the Tetra 640 plasma system can be further developed to meet future requirements. Thanks to the flexible modular system, the choice of single- or multi-tier electrodes depends on the specific application. For complex, larger components that take up a lot of space in the chamber, an electrode that ensures uniform treatment is ideal. To ensure uniform treatment in every application, multi-tier electrodes or a rotary drum electrode are installed for many small components arranged across several tiers.
Control
For demanding industrial production environments, the control unit – featuring a full PC running Windows IoT as the operating system – is ideal for the Low-Pressure Plasma Tetra 640 system. This ensures the archiving of processes, alarm lists, remote diagnostics and network connectivity. Process transparency and traceability form the basis for efficient and cost-effective production. A range of hardware configurations offers maximum flexibility for the processes to be carried out. The PI/PID pressure regulator enables pressure stabilisation, which ensures that processes are precisely reproducible at all times. With the Full PC control system, ongoing processes are displayed in a way that makes them easier to grasp, in greater detail and at a faster pace.
Technical data
Housing dimensions
Standalone
Control unit
Full PC (Windows 11 IoT Enterprise)
Vacuum chamber
Aluminium, Hinged door
W 800 mm x H 800 mm x D 1000 mm; Volume approx. 640 liters
Optional: Depth modularly expandable in 500 mm steps
Generator
80.00 kHz | Power output 0 - 1000 W
13.56 MHz | Power output 0 - 1000 W
13.56 MHz | Power output 0 - 3000 W
Gas supply
MFC (Mass flow controller)
Electrode
Single-tier electrode
Multi-tier electrode
Pressure measurement
Pirani sensor
Capacity pressure gauge
Power supply
400 V | 16 - 125 A
Technical changes reserved.
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FAQ Frequently Asked Questions
What types of impurities can be removed?
All organic, film-like contaminants up to a size of approximately 1 micrometre can be removed using Diener electronic’s plasma systems.
Can metal chips or dust be removed from components?
Unfortunately, it is not possible to clean metal shavings or dust from the surfaces.
How long can activated parts be stored before further processing?
The curing time of the components depends on the activation time and the material, and varies from a few minutes to several months. It is therefore often necessary to carry out tests on site.
Metals, ceramics, glass and elastomers: a few hours
; plastics (excluding elastomers): several days, weeks or months
How should treated parts be stored?
Following plasma treatment, it is advisable not to store the parts in the open, as they attract dust, organic contamination and moisture.
Sealed parts have a significantly longer shelf life than those stored in the open.
Parts treated by us on a contract basis are packaged in close consultation with the customer, e.g. in certified silicone-free PE bags, ESD packaging or customer-specific packaging material provided to us.
How can plasma activation be measured?
Contact angle / edge angle
The contact angle is the angle formed by the tangent to the drop’s contour and the surface of the solid at the three-phase point when observing the projection of the lying drop onto the solid. According to the physical definition, a surface with a contact angle of less than 90° is hydrophilic (wettable), whilst one with a contact angle greater than 90° is hydrophobic (non-wettable). The contact angle can be altered (increased or decreased) by means of plasma treatment. Using a suitable plasma process or by applying a suitable coating via a plasma process, hydrophilic surfaces can be converted into hydrophobic ones (and vice versa using hydrophilic layers).
Test inks from Diener electronic
Instruments for estimating surface energy: If the test ink contracts after being applied to the surface, the surface energy of the solid is lower than that of the ink; if wetting is maintained, the surface energy of the solid is equal to or greater than that of the liquid. By using a series of test inks with graduated surface energies, the total surface tension of a solid can thus be determined. However, the polar and non-polar components of the surface energy cannot be determined using this method.
Cross-cut test
To check the adhesion of paint finishes, a cross-cut test (standards: DIN EN ISO 2409 and ASTM D3369-02) is carried out. After painting, the paint layer on the plastic component is scored in a grid pattern. A standardised adhesive tape is then applied to the cross-hatch pattern, pressed down firmly and pulled off abruptly. If paint remains on the adhesive tape, the adhesion of the paint finish is poor. The cross-hatch test thus indicates the adhesion strength of paint layers on plastic parts.
Can plastics be coated using plasma polymerisation?
Plastics can generally be coated quite easily using plasma polymerisation. The Process Development department at Diener electronic will be happy to advise you on whether your specific requirements can be met.
For example, CDs and DVDs can be coated with a scratch-resistant layer without compromising their quality.
PTFE-like coatings can be applied to improve the lubricity of the treated items. Furthermore, it is possible to attach specific functional groups to the plastic surface (e.g. amino groups for bioanalytical applications).
What effects can be achieved by coating metals using plasma polymerisation?
Coating metals using plasma polymerisation allows for various effects, e.g. activation lasting from one to several weeks, and the application of both decorative and functional coatings. A sputtering system is generally particularly well suited for use with metals.
Is it possible to etch metals?
Etching metals is possible in principle, but only with highly corrosive gases, which in turn can cause the metal to corrode. To enhance the etching effect, the parts can be preheated – or, if a chamber heater is installed in the plasma system, they can be heated continuously.
What types of coatings can be produced using low-pressure plasma, and which monomers are used for this?
Low-pressure plasma is primarily suitable for producing hydrophobic/hydrophilic, adhesive and anti-friction coatings.
Silicon- and carbon-containing substances are used as monomers. These include, for example, various acrylates and common silicon-containing monomers of the HMDSO type.
Which monomers must not be used?
Due to their highly toxic nature, halogen-containing gases and monomers (F₂, Cl₂, Br₂, I) must not be used with atmospheric plasma!
What coating thicknesses can be achieved using low-pressure plasma, and how can these be measured?
Depending on the coating, different coating thicknesses can be achieved; these depend on various factors, such as the geometry of the workpieces, the intended application, the flexibility and stability of the coating, and much more. Our Process Engineering department will be happy to demonstrate solutions for this.
Can powder be coated?
Yes, it is possible to coat powders using a specialised process. Diener electronic’s specialised systems for powders and bulk materials are designed for this purpose.
Is there an alternative to hydrogen in the Tetra 640 system?
Upon request to Diener electronic, a hydrogen generator or water vapour may be considered as an alternative to hydrogen for the Tetra 640 system.
Are exhaust air filters required for the Tetra 640?
Yes, all systems must be connected to a proper exhaust system, regardless of the type of gas used. Nitrogen oxides, exhaust gases, fine oil mist (from oil pumps), etc. are produced, which must not be inhaled; furthermore, the gases are often acidic, meaning they accelerate the rusting of surrounding parts, machinery and equipment.
