Low-Pressure PlasmaPlasma system Tetra 360
Modular plasma system for growing requirements
With a chamber volume of 360 litres and a modular vacuum chamber system housed in a spacious enclosure, the system can be optimally adapted to new products, larger components and changing production requirements.
Start an inquiry
Flexibility for today’s and tomorrow’s production requirements
The Tetra 360 plasma system combines a generous chamber volume with a modular system design. The vacuum chamber system allows for customisation to suit different component sizes and future production requirements.
Depending on the application, various control options are available – ranging from standardised process programmes to a fully customisable PC-based control system with process archiving, alarm management and optional MES integration. This ensures that all process steps remain transparent and traceable.
With its flexible system design, the Tetra 360 is suitable for both development departments and industrial series production. Companies benefit from a high level of investment security, as the system can be further developed to meet future requirements.
Cleaning
The Low-Pressure Plasma system Tetra 360 offers solutions for ultra-precise cleaning of all surfaces, for every substrate, and for every post-treatment process. Plasma cleaning removes all organic residues without subjecting the component to chemical or thermal stress.
More information
Activation
Good surface wettability is a prerequisite for the adhesion of bonding partners during painting, gluing, printing, or bonding. Plasma activation using the Low-Pressure Plasma Tetra 360 system creates polar bonding partners and increases the surface energy.
More information
Coating
The Low-Pressure Plasma Tetra 360 system can also modify surfaces by applying a coating. Plasma coating can be used to deposit hydrophobic, hydrophilic, protective, or insulating layers of any kind.
More information
Etching
The plasma technology of the Low-Pressure Plasma Tetra 360 system enables anisotropic and isotropic etching. This results in the nanostructuring of surfaces, which increases their surface area and improves adhesion.
More information
360 litres chamber
The Low-Pressure Plasma Tetra 360 system is equipped with a large chamber volume of 360 litres, which is ideally suited to large industrial components. The chamber can be designed to be shorter or deeper in 500 mm increments. An aluminium chamber is available for this purpose, ensuring particularly safe and stable industrial processes. The generous chamber size allows for the simultaneous processing of complex or multiple components, making the Tetra 360 ideally suited to industrial production processes and series production applications.
The modular vacuum chamber system enables easy integration into existing production environments.
Electrode
As technology advances, so do the requirements. With Diener electronic, companies benefit from a high degree of investment security, as the Low-Pressure Plasma system Tetra 360 can be further developed to meet future requirements. The adaptable modular system allows you to choose between single-stage and multi-stage electrodes when designing the Tetra 360, depending on the intended application. For complex, larger components that take up a lot of space in the chamber, an electrode that ensures uniform treatment is ideal. For many small components arranged across several levels, multi-tier electrodes or a rotary drum electrode are installed to ensure uniform treatment in every application.
Control
For demanding industrial production environments, the control unit – featuring a full PC running Windows IoT as its operating system – is ideal for the Tetra 360. This ensures the archiving of processes, alarm lists, remote diagnostics and network connectivity. Process transparency and traceability form the basis for efficient and cost-effective production. A range of hardware configurations offers maximum flexibility for the processes to be carried out. The PI/PID pressure regulator enables pressure stabilisation, ensuring that processes are precisely reproducible at all times. With the Full PC control system, ongoing processes are displayed in a way that makes them easier to grasp, in greater detail and at a faster pace
Technical data
Housing dimensions
Standalone
Control unit
Full PC (Windows 11 IoT Enterprise)
Vacuum chamber
Aluminium, Hinged door
W 600 mm x H 600 mm x D 1000 mm; Volume approx. 360 liters
Optional: Depth modularly expandable in 500 mm steps
Generator
80.00 kHz | Power output 0 - 1000 W
13.56 MHz | Power output 0 - 1000 W
13.56 MHz | Power output 0 - 3000 W
Gas supply
MFC (Mass flow controller)
Electrode
Single-tier electrode
Multi-tier electrode
Pressure measurement
Pirani sensor
Capacity pressure gauge
Power supply
400 V | 16 - 125 A
Technical changes reserved.
Get a custom quote for Low-Pressure Plasma Tetra 360?
Start an inquiryOther interesting products
FAQ Frequently Asked Questions
What connectivity options are available for the software control system on the Tetra 360 system?
With its full PC control system, the Tetra 360 plasma system from Diener electronic offers the following connection options, such as:
- higher-level control systems, e.g. via Profinet
- MES systems, e.g. via OPC UA
- Database connection via ODBC
What can be covered using the Tetra 360?
The Tetra 360 from Diener electronic can be used to process all vacuum-resistant materials.
How much can be applied using the Tetra 360 system during coating?
The Tetra 360 system from Diener electronic can be used to apply a coating down to the lower micrometre range (< 1 micrometre).
Which gases can be used with the Tetra 360?
The following gases can be used in the Tetra 360 and, more generally, in low-pressure plasma: O₂, N₂, Ar, ambient air, CO₂, H₂O vapour and forming gas
Can temperature-sensitive components be processed using the Tetra 360?
Yes, as this is a cold plasma, the low-pressure plasma systems Tetra 360 from Diener electronic are suitable for temperature-sensitive components.
What is the typical process temperature for the Tetra 360 in the vacuum chamber?
With the Tetra 360 from Diener electronic, the temperature is normally between room temperature and approximately 80 °C – depending on the component, chamber type, process time and load quantity. Higher temperatures can be achieved on request from Diener electronic using heating elements.
Can the Tetra 360 system handle magnetic components?
Magnetic components can also be processed effectively in the vacuum chamber of the Tetra 360 from Diener electronic.
Can ESD-sensitive components be handled using the Tetra 360?
Yes, this is possible using low-pressure plasma of the Tetra 360. A trial can be carried out in our process department on request.
What is the typical pressure range usually found in the vacuum chamber of the Tetra 360?
The typical pressure range of the Tetra 360 is adjustable from 0.1 to 1.0 mbar, depending on the defined low-pressure plasma process.
Are exhaust air filters required for the Tetra 360?
Yes, all systems must be connected to a proper exhaust system, regardless of the type of gas used. Nitrogen oxides, exhaust gases, fine oil mist (from oil pumps), etc. are produced, which must not be inhaled; furthermore, the gases are often acidic, meaning they accelerate the rusting of surrounding parts, machinery and equipment.
What is the frequency of the GHz system Tetra 360?
The generators for the GHz system Tetra 360 operate at an ISM frequency of 2.45 MHz – comparable in intensity to that of a microwave. Please enquire about the safety guidelines for people with pacemakers.
Which surfaces can be activated using the Tetra 360 plasma system?
The Tetra 360 plasma system from Diener electronic can be used to activate the following surfaces: plastics, metals, glass, ceramics and textiles.
Can the control software for the Tetra 360 plasma system be adapted to meet our requirements?
On request, we at Diener electronic can customise the full PC control system for the Tetra 360 series. Please do get in touch with us regarding this.
