Low-Pressure PlasmaPlasma system Tetra 2800
Plasma system for large-format components and special applications
With a chamber volume of 2827 litres, the Tetra 2800 plasma system is suitable for particularly large, long or complex workpieces, as well as for high-volume production in industrial manufacturing. It therefore provides the ideal conditions for the plasma treatment of complex components.
Start an inquiry
Maximum capacity for demanding industrial applications
With its generous chamber volume of 2827 litres, the Tetra 2800 plasma system offers sufficient space for large-format components, long workpieces or complete assemblies. It has been developed for applications where standard systems are insufficient due to component size or process requirements.
The modular system concept allows for custom configuration of the vacuum chamber, process equipment and control system. This enables the plasma system to be tailored precisely to the requirements of your production.
Depending on the version, state-of-the-art PC-based control systems with process monitoring, documentation and archiving are available. Optional integration into Manufacturing Execution Systems (MES) supports digital manufacturing and ensures seamless traceability of processes.
The Tetra 2800 is suitable for all common low-pressure plasma processes and ensures reproducible results in the cleaning, activation, etching and functionalisation of a wide variety of surfaces.
Cleaning
The Low-Pressure Plasma system Tetra 2800 offers solutions for ultra-precise cleaning of all surfaces, for every substrate, and for every post-treatment process. Plasma cleaning removes all organic residues without subjecting the component to chemical or thermal stress.
More information
Activation
Good surface wettability is a prerequisite for the adhesion of bonding partners during painting, gluing, printing, or bonding. Plasma activation using the Low-Pressure Plasma Tetra 2800 system creates polar bonding partners and increases the surface energy.
More information
Coating
The Low-Pressure Plasma Tetra 2800 system can also modify surfaces by applying a coating. Plasma coating can be used to deposit hydrophobic, hydrophilic, protective, or insulating layers of any kind.
More information
Etching
The plasma technology of the Low-Pressure Plasma Tetra 2800 system enables anisotropic and isotropic etching. This results in the nanostructuring of surfaces, which increases their surface area and improves adhesion.
More information
2827l chamber
The Low-Pressure Plasma Tetra 2800 system is equipped with an immense chamber volume of 2827 litres, which is ideally suited to large industrial components. It features a round aluminium chamber that ensures particularly safe and stable industrial processes. The generous chamber size allows for the simultaneous treatment of complex or multiple components, making the Tetra 2800 ideally suited to industrial production processes and series production applications. Thanks to the round shape of the chamber, the Low-Pressure Plasma Tetra 2800 offers a wide range of treatment options for a variety of applications.
Electrode
Requirements are increasing as technology advances. With Diener electronic, companies benefit from a high level of investment security, as the Low-Pressure Plasma system Tetra 2800 can be further developed to meet future requirements. Thanks to the flexible modular system, you can choose the Tetra 2800 plasma system and select between single-tier or multi-tier electrodes, depending on the application. For complex, larger components that take up a lot of space in the chamber, an electrode that ensures uniform treatment is ideal. For many small components arranged across several levels, multi-tier electrodes, side electrodes or even a rotary drum electrode with removable baskets are installed to ensure uniform treatment in every application of the Tetra 2800 plasma system.
Control
In industrial sectors with high production demands, the control unit, when used in conjunction with a full PC running Windows IoT, is ideal. This ensures that the Tetra 2800 plasma system has access to process archiving, alarm lists, remote diagnostics and network connectivity. Process transparency and traceability form the basis for efficient and cost-effective production. A range of hardware configurations offers maximum flexibility for the processes to be carried out by the Tetra 2800 plasma system. The PI/PID pressure regulator enables pressure stabilisation, which ensures that processes are precisely reproducible at all times. With the Full PC control system, ongoing processes are displayed in a more comprehensive, detailed and easily accessible manner.
Technical data
Housing dimensions
Tetra 2800
Control unit
Basic PC (Windows CE)
Full PC (Windows 11 IoT Enterprise)
Vacuum chamber
Stainless steel, Hinged door
⌀ 1200 mm x
D 2500 mm; Volume approx. 2827 liters
Generator
80.00 kHz | Power output 0 - 1000 W
80.00 kHz | Power output 0 - 3000 W
13.56 MHz | Power output 0 - 600 W
13.56 MHz | Power output 0 - 1000 W
2.45 GHz | Power output 0 - 850 W
Gas supply
MFC (Mass flow controller)
Electrode
Single-tier electrode
Multi-tier electrode
Pressure measurement
Pirani sensor
Capacity pressure gauge
Power supply
400 V | 16 - 125 A
Technical changes reserved.
Get a custom quote for Low-Pressure Plasma Tetra 2800?
Start an inquiryOther interesting products
FAQ Frequently Asked Questions
What sets your atmospheric and low-pressure plasma surface treatment equipment, units and systems apart from those of your competitors?
The equipment and systems for plasma surface treatment from Diener electronic stand out from those of their market competitors due to:
- over 20 years’ experience with AD and 30 years’ experience with ND in a variety of production environments at our customers’ sites, thanks to the reliability of the technology
- several thousand systems already installed
- compact design
- modern communication protocols are available on PC models, such as Profinet, EtherCAT, etc.
Is low-pressure or atmospheric-pressure plasma the better solution?
When it comes to surface treatment at Diener electronic, there is no such thing as ‘better or worse’, but rather ‘suitable or unsuitable for the application’.
Which surfaces can be activated using the Tetra 2800 plasma system?
The Tetra 2800 plasma system from Diener electronic can be used to activate the following surfaces: plastics, metals, glass, ceramics and textiles.
How should treated parts be stored?
Following plasma treatment, it is advisable not to store the parts in the open, as they attract dust, organic contamination and moisture.
Sealed parts have a significantly longer shelf life than those stored in the open.
Parts treated by us on a contract basis are packaged in close consultation with the customer, e.g. in certified silicone-free PE bags, ESD packaging or customer-specific packaging material provided to us.
What connectivity options are available for the software control system on the Tetra 2800 system?
With its full PC control system, the Tetra 2800 plasma system from Diener electronic offers the following connection options, such as:
- higher-level control systems, e.g. via Profinet
- MES systems, e.g. via OPC UA
- Database connection via ODBC
What can be covered using the Tetra 2800?
The Tetra 2800 from Diener electronic can be used to process all vacuum-resistant materials.
How much can be applied using the Tetra 2800 system during coating?
The Tetra 2800 system from Diener electronic can be used to apply a coating down to the lower micrometre range (< 1 micrometre).
Which gases can be used with the Tetra 2800?
The following gases can be used in the Tetra 2800 and, more generally, in low-pressure plasma: O₂, N₂, Ar, ambient air, CO₂, H₂O vapour and forming gas
Can temperature-sensitive components be processed using the Tetra 2800?
Yes, as this is a cold plasma, the low-pressure plasma systems Tetra 2800 from Diener electronic are suitable for temperature-sensitive components.
Can the Tetra 2800 system handle magnetic components?
Magnetic components can also be processed effectively in the vacuum chamber of the Tetra 2800 from Diener electronic.
What is the typical process temperature for the Tetra 2800 in the vacuum chamber?
With the Tetra 2800 from Diener electronic, the temperature is normally between room temperature and approximately 80 °C – depending on the component, chamber type, process time and load quantity. Higher temperatures can be achieved on request from Diener electronic using heating elements.
Are exhaust air filters required for the Tetra 2800?
Yes, all systems must be connected to a proper exhaust system, regardless of the type of gas used. Nitrogen oxides, exhaust gases, fine oil mist (from oil pumps), etc. are produced, which must not be inhaled; furthermore, the gases are often acidic, meaning they accelerate the rusting of surrounding parts, machinery and equipment.
