The chamber can be heated to approx. 80 °C. The temperature can be controlled. It is intended for defined process conditions and higher etch rates.
Comprised in the polymerisation accessories, the bubbler bottle is required for connecting liquid monomers to the vacuum chamber. A carrier gas is used instead of the simple monomer bottle. The monomer is purged with a carrier gas, e.g. argon.
A butterfly valve is used to regulate a gas flow; in vacuum technology, it is provided primarily in the intake line of a vacuum pump. To this end, the flow resistance in the line is changed by adjusting a valve which can close the line to a small or large degree.
The pressure reducer is intended for connection to the gas bottle – 200 bar. Different gases require different pressure reducers. One is intended for noble gases H2, O2, CF4, C4F8, one for NH3.
The spare parts kit includes 1 clamping ring, 1 seal, 1 stainless steel flexible tube (vacuum tube), 1 window pane, 1 door seal, 10 pieces miniature fuses for the plasma system, as well as 1 litre of mineral oil for the vacuum pump with the standard kit, and 1 litre of PFPE oil for the vacuum pump with the PFPE kit.
ESD stands for electrostatic discharge. On the shop floor, sensitive electronic components must be protected from electrostatic discharges. If you intend to use a plasma system for manufacturing this type of components, the system can be specifically equipped to prevent the occurrence of electrical discharges.
For electrically sensitive components. The components to be treated are in the Faraday cage. It can be removed from the vacuum chamber.
Can be attached to the work table, shelves or wall ledges. Its span width is 70 mm. The strap holds the bottle without any room for play. It is suitable for all bottle sizes.
Additional safety option for workplaces using combustible gases. Accessories for carrying out a paint-wetting impairment test. Scope of delivery: Spray paint in cans, 5 pieces à 400 ml, and glass plates 100 pieces, each 90 mm x 110 mm.
Some plasma processes require hydrogen as a process gas. Accidental leakage of hydrogen caused by a technical defect can become dangerous quickly. The escaping hydrogen may ignite and cause an explosion in the worst case. To prevent this hazard, plasma systems with full PC control can be equipped with a gas detector. It recognises increased hydrogen concentration in the ambient air and raises alarm.
A rubber mat can be ordered to protect the top of the plasma system if you wish to use it as storage space. It protects the plasma system from damage. It furthermore acts as a “non-slip mat” for the parts deposited on the system.
The components to be treated sit on the heating plate, which can be heated to max. 150 °C and is suitable for defined process conditions and higher etching rates. There are two options available:
Equipped with a temperature indicator: A thermal sensor is arranged inside the vacuum chamber for measuring the surface temperature of the component. Equipped with the temperature indicator integrated into the PC control: Here, too, a thermal sensor is arranged inside the vacuum chamber for measuring the surface temperature of the component. The temperature is indicated on the screen.
The vacuum chamber is vented at slow speed by means of a filter. This prevents small components from spinning around in the chamber.
The multi-tier electrode is available for round and/or rectangular vacuum chambers. Several components can be treated at the same time. Suitable for standard plasma processes. Please contact Diener electronic regarding the exact design of your individual electrode and other materials for manufacture of the product carriers.
For microwave systems, it may be advisable to provide a microwave leak tester as a protection from hazardous radiation.
Monitoring of the plasma process for quality assurance. Detection of the end point of the plasma process. OES is available only for systems with PC control.
Oxygen bottle for connection as process gas with capacity 2, 5 and 10 litres, hydrogen bottle with capacity 2 litres, Argon bottle with capacity 5 litres. Special transport conditions apply for the supply of gas. Gas bottles for rental systems must be bought.
Circular or rectangular stainless steel electrode, for higher etch rates. Suitable for anisotropic and isotropic etching.
Rectangular stainless steel electrode. Achieves higher etch rates due to more homogeneous gas distribution.
Used in anisotropic etching processes.
Diener electronic offers its customers the suitable automation solution for every process, whether cleaning, activating, etching or coating. All processes can be automated autonomously or in a fully integrated manner. To this end, Diener electronic offers fully automatic low-pressure plasma systems and fully automatic atmospheric pressure plasma systems. Tailored to the requirements, automatic product carriers, articulated or 3-axes robots are used.
For implementation of the automation, we can resort to experienced partners who know how to realize also complex and fully integrated automation solutions.
Please contact Diener electronic regarding the exact design of your individual electrode and other materials for manufacture of the product carriers.
In accordance with DIN 12198, a UV irradiation measurement was performed on our systems (inspection glass). Result: harmless. Special vacuum chambers are available in round form with a lid and rectangular form with hinged door. Made of aluminium, they also have different opening diameters and inner dimensions. Please do not hesitate to ask for advice.
Special device for insertion into the plasma chamber from outside. Can be manufactured in any size. Please inform us of the dimensions of your parts, or submit drawings.
A thermal sensor is arranged inside the vacuum chamber. The temperature in the vacuum chamber is indicated on a separate display.
Temperature indicator for the chamber temperature without heating plate. Can be used to measure the surface temperature of the components. The temperature indicator can also be integrated in the PC control. In this case, the temperature is indicated on the screen.
A thermal sensor is arranged inside the vacuum chamber.
The temperature in the chamber is indicated directly in the system control.
For processes with corrosive gases, dry-running pumps can also be used. However, these must then be specially designed for this high load. They can also cope with particle, condensation or corrosion by-products. The benefit of the dry-running pump is its optimised utilities consumption. The pumps require no preventive maintenance (oil change).
Borosilicate glass vacuum chambers are for high-purity plasma processes. Quartz glass vacuum chambers are for ultra high-purity plasma processes.
Powder is treated in a rotating glass bottle. For filling, the bottle can be removed from the system.
For initial cleaning of small items before plasma treatment. Only required for heavily soiled items. Manufacturer: Miele: Type WT 2670 WPM.
In the plasma system, the items rest on so-called product carriers. They are manufactured individually to match the type of parts and process. Often, double the number of product carriers is manufactured for a system so that the next product carriers can be loaded with items while the first batch is being processed.
Needle valves: Our systems can be equipped with any number of needle valves. By default, a Femto plasma system is equipped with 1-3 needle valves, but more are possible on request.