Low-Pressure PlasmaPlasma system Tetra 4300
Modular plasma system for very large components and batches
The Tetra 4300 low-pressure plasma system, in its standard version with a chamber volume of approximately 4320 litres, enables the plasma surface treatment of very large components and batches. Thanks to the modular plasma chamber, which can be adjusted in 500 mm increments, the depth – and thus the chamber volume – can be individually tailored to your requirements.
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Maximum chamber volume in a highly space-saving housing
The Tetra 4300 low-pressure plasma system has been developed for demanding industrial applications where our previous standard systems reach their limits. With a chamber volume of 4320 litres in the standard version and a modular vacuum chamber constructed from aluminium profiles, the system can be flexibly adapted to different component sizes and production requirements. The system is ideally suited to plasmacleaning, surface activation, plasma etching and plasma coating of large, long and numerous workpieces.
The Tetra 4300’s full PC-based control system enables the documentation and archiving of all process parameters, as well as integration into higher-level production systems via an optional MES connection.
The incredible dimensions of the aluminium vacuum chamber within the space-saving housing leave nothing to be desired, both in terms of application possibilities and value for money.
Cleaning
The Low-Pressure Plasma system Tetra 4300 offers solutions for ultra-precise cleaning of all surfaces, for every substrate, and for every post-treatment process. Plasma cleaning removes all organic residues without subjecting the component to chemical or thermal stress.
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Activation
Good surface wettability is a prerequisite for the adhesion of bonding partners during painting, gluing, printing, or bonding. Plasma activation using the Low-Pressure Plasma Tetra 4300 system creates polar bonding partners and increases the surface energy.
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Coating
The Low-Pressure Plasma Tetra 4300 system can also modify surfaces by applying a coating. Plasma coating can be used to deposit hydrophobic, hydrophilic, protective, or insulating layers of any kind.
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Etching
The plasma technology of the Low-Pressure Plasma Tetra 4300 system enables anisotropic and isotropic etching. This results in the nanostructuring of surfaces, which increases their surface area and improves adhesion.
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4320 litres chamber
The Low-Pressure Plasma Tetra 4300 plasma system is equipped with a large chamber volume of 4320 litres, making it ideally suited for large components or large batches in industrial applications. Furthermore, the chamber can be designed to be shorter or deeper in 500 mm increments. The aluminium chamber ensures particularly safe and stable industrial processes. The generous chamber volume allows for the simultaneous treatment of complex or multiple components, making the Tetra 4300 ideally suited for industrial production processes and series applications. Easy integration into existing production environments is facilitated by the option of two-part loading trolleys and an automatic door.
High-end plasma processes
Requirements are increasing as technology advances. With Diener electronic, companies benefit from a high level of investment security, as the Tetra 4300 system can be further developed to meet future requirements. Thanks to the flexible modular system, the choice of single- or multi-tier electrodes for the Tetra 4300 plasma system is determined by the specific application. For complex, larger components that take up a lot of space in the chamber, an electrode that ensures uniform treatment is ideal. For many small components arranged across several levels, multi-tier electrodes or a rotary drum electrode are installed to ensure uniform treatment in every application of the Tetra 4300 plasma system.
Our FULL PC control system
In industrial sectors with high production demands, the control unit, when used in conjunction with a FULL PC running Windows IoT, is ideal. This ensures that the Low-Pressure Plasma Tetra 4300 system has process archiving, alarm lists, remote diagnostics and network connectivity. Process transparency and traceability form the basis for efficient and cost-effective production. A range of hardware configurations offers maximum flexibility for the processes carried out by the Tetra 4300 plasma system. The PI/PID pressure regulator enables pressure stabilisation, which ensures that processes are precisely reproducible at all times. With the Full PC control system, ongoing processes are displayed in a way that makes them easier to monitor, with greater detail and at a faster rate.
Technical data
Housing dimensions
Standalone
Control unit
Full PC (Windows 11 IoT Enterprise)
Vacuum chamber
Aluminium, Hinged door
W 1600 mm x H 1800 mm x D 1500 mm; Volume approx. 4320 liters
Optional: Depth modularly expandable in 500 mm steps
Generator
80 kHz | Power output 0 - 5000 W
Gas supply
MFC (Mass flow controller)
Needle valve
Electrode
Multi-tier electrode
Pressure measurement
Pirani sensor
Capacity pressure gauge
Power supply
400 V | 16 - 125 A
Technical changes reserved.
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FAQ Frequently Asked Questions
What extensions are possible with the Tetra 4300?
With the Tetra 4300 from Diener electronic, extensions such as a rotary drum for bulk materials, roll-to-roll systems for virtually continuous films/textiles, or automatic doors for autonomous operation on the production line are usually possible. Get in touch: “We create solutions.”
What information do we need from you in order to provide you with a quote?
To provide a quotation for Diener electronic, we require component specifications such as dimensions, material, temperature sensitivity, as well as the type of process and planned quantities.
What connectivity options are available for the software control system on the Tetra 4300 system?
With its full PC control system, the Tetra 4300 plasma system from Diener electronic offers the following connection options, such as:
- higher-level control systems, e.g. via Profinet
- MES systems, e.g. via OPC UA
- Database connection via ODBC
Which surfaces can be activated using the Tetra 4300 plasma system?
The Tetra 4300 plasma system from Diener electronic can be used to activate the following surfaces: plastics, metals, glass, ceramics and textiles.
Which gases can be used with the Tetra 4300?
The following gases can be used in the Tetra 4300 and, more generally, in low-pressure plasma: O₂, N₂, Ar, ambient air, CO₂, H₂O vapour and forming gas
Can temperature-sensitive components be processed using the Tetra 4300?
Yes, as this is a cold plasma, the low-pressure plasma systems Tetra 4300 from Diener electronic are suitable for temperature-sensitive components.
What is the typical process temperature for the Tetra 4300 in the vacuum chamber?
With the Tetra 4300 from Diener electronic, the temperature is normally between room temperature and approximately 80 °C – depending on the component, chamber type, process time and load quantity. Higher temperatures can be achieved on request from Diener electronic using heating elements.
What is the typical pressure range usually found in the vacuum chamber of the Tetra 4300?
The typical pressure range of the Tetra 4300 is adjustable from 0.1 to 1.0 mbar, depending on the defined low-pressure plasma process.
Is there an alternative to hydrogen in the Tetra 4300 system?
Upon request to Diener electronic, a hydrogen generator or water vapour may be considered as an alternative to hydrogen for the Tetra 4300 system.
Are exhaust air filters required for the Tetra 4300?
Yes, all systems must be connected to a proper exhaust system, regardless of the type of gas used. Nitrogen oxides, exhaust gases, fine oil mist (from oil pumps), etc. are produced, which must not be inhaled; furthermore, the gases are often acidic, meaning they accelerate the rusting of surrounding parts, machinery and equipment.
Can the control software for the Tetra 4300 plasma system be adapted to meet our requirements?
On request, we at Diener electronic can customise the full PC control system for the Tetra 4300 series. Please do get in touch with us regarding this.
