Low-Pressure PlasmaPlasma system Tetra 1000
High process throughput for industrial plasma applications
The Tetra 1000 low-pressure plasma system, with a chamber volume of 1000 litres, has been specially developed for companies wishing to treat large components or high volumes cost-effectively using low-pressure plasma. Thanks to its modular vacuum chamber system, the plasma system can be configured to suit different component sizes and process requirements.
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High-performance plasma system for large-volume processes
The Tetra 1000 combines a generous chamber volume with a modular system architecture and is suitable for demanding industrial applications. The system offers sufficient space for large workpieces or the simultaneous processing of multiple components, thereby supporting cost-effective process flows.
The modular vacuum chamber system allows for customisation to suit different component sizes and future production requirements. Companies benefit from a long-lasting solution that can keep pace with increasing demands.
Depending on the process, various PC control systems are available, ranging up to full PC control. This enables the convenient management and documentation of process parameters, as well as integration into existing production and quality assurance systems.
The Tetra 1000 is suitable for numerous low-pressure plasma technology processes and supports reproducible processes in industrial manufacturing environments.
Cleaning
The Low-Pressure Plasma system Tetra 1000 offers solutions for ultra-precise cleaning of all surfaces, for every substrate, and for every post-treatment process. Plasma cleaning removes all organic residues without subjecting the component to chemical or thermal stress.
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Activation
Good surface wettability is a prerequisite for the adhesion of bonding partners during painting, gluing, printing, or bonding. Plasma activation using the Low-Pressure Plasma Tetra 1000 system creates polar bonding partners and increases the surface energy.
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Coating
The Low-Pressure Plasma Tetra 1000 system can also modify surfaces by applying a coating. Plasma coating can be used to deposit hydrophobic, hydrophilic, protective, or insulating layers of any kind.
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Etching
The plasma technology of the Low-Pressure Plasma Tetra 1000 system enables anisotropic and isotropic etching. This results in the nanostructuring of surfaces, which increases their surface area and improves adhesion.
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1000 l chamber
The Low-Pressure Plasma Tetra 1000 system is equipped with a large chamber volume of 1000 l, which is ideally suited to very large industrial components. Furthermore, the chamber can be designed to be shorter or deeper in 500 mm increments. An aluminium chamber is available for this purpose, ensuring particularly safe and stable industrial processes. The generous chamber size allows for the simultaneous processing of complex or multiple components, making the Tetra 1000 ideally suited to industrial production processes and mass-production applications. The modular vacuum chamber system facilitates easy integration into existing production environments.
Electrode
Requirements are increasing as technology advances. With Diener electronic, companies benefit from a high degree of investment security, as the system can be adapted to meet future requirements. The adaptable modular system allows you to choose between single- and multi-tier electrodes when designing the Tetra 1000, depending on the intended application. For complex, larger components that take up a lot of space in the chamber, it is advisable to install an electrode that ensures uniform treatment. To ensure uniform treatment in every application, a rotary drum electrode is used for many small components or, if they extend over several levels, multi-level electrodes are installed.
Control
In industrial sectors with high production demands, this control unit, when used in conjunction with a full PC running Windows IoT, is ideal. This ensures the archiving of processes, alarm lists, remote diagnostics and network connectivity. Process transparency and traceability form the basis for efficient and cost-effective production. A range of hardware configurations offers maximum flexibility for the processes to be carried out. The PI/PID pressure regulator enables pressure stabilisation, ensuring that processes are precisely reproducible at all times. The full PC control system enables a more comprehensive visualisation of running processes, as well as a more detailed and easily comprehensible display.
Technical data
Housing dimensions
Standalone
Control unit
Full PC (Windows 11 IoT Enterprise)
Vacuum chamber
Aluminium, Hinged door
W 1000 mm x H 1000 mm x D 1000 mm; Volume approx. 1000 liters
Optional: Depth modularly expandable in 500 mm steps
Generator
80.00 kHz | Power output 0 - 5000 W
Gas supply
MFC (Mass flow controller)
Electrode
Single-tier electrode
Multi-tier electrode
Pressure measurement
Pirani sensor
Capacity pressure gauge
Power supply
400 V | 16 - 125 A
Technical changes reserved.
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FAQ Frequently Asked Questions
Which vacuum chamber or generator is right for my application?
Depending on your requirements, Diener electronic offers the appropriate vacuum chamber or generator.
What information do we need from you in order to provide you with a quote?
To provide a quotation for Diener electronic, we require component specifications such as dimensions, material, temperature sensitivity, as well as the type of process and planned quantities.
What can be covered using the Tetra 1000?
The Tetra 1000 from Diener electronic can be used to process all vacuum-resistant materials.
Which surfaces can be activated using the Tetra 1000 plasma system?
The Tetra 1000 plasma system from Diener electronic can be used to activate the following surfaces: plastics, metals, glass, ceramics and textiles.
How much can be applied using the Tetra 1000 system during coating?
The Tetra 1000 system from Diener electronic can be used to apply a coating down to the lower micrometre range (< 1 micrometre).
Which gases can be used with the Tetra 1000?
The following gases can be used in the Tetra 1000 and, more generally, in low-pressure plasma: O₂, N₂, Ar, ambient air, CO₂, H₂O vapour and forming gas
What is the typical pressure range usually found in the vacuum chamber of the Tetra 1000?
The typical pressure range of the Tetra 1000 is adjustable from 0.1 to 1.0 mbar, depending on the defined low-pressure plasma process.
What is the typical process temperature for the Tetra 1000 in the vacuum chamber?
With the Tetra 1000 from Diener electronic, the temperature is normally between room temperature and approximately 80 °C – depending on the component, chamber type, process time and load quantity. Higher temperatures can be achieved on request from Diener electronic using heating elements.
Is there an alternative to hydrogen in the Tetra 1000 system?
Upon request to Diener electronic, a hydrogen generator or water vapour may be considered as an alternative to hydrogen for the Tetra 1000 system.
Are exhaust air filters required for the Tetra 1000?
Yes, all systems must be connected to a proper exhaust system, regardless of the type of gas used. Nitrogen oxides, exhaust gases, fine oil mist (from oil pumps), etc. are produced, which must not be inhaled; furthermore, the gases are often acidic, meaning they accelerate the rusting of surrounding parts, machinery and equipment.
Can the control software for the Tetra 1000 plasma system be adapted to meet our requirements?
On request, we at Diener electronic can customise the full PC control system for the Tetra 1000 series. Please do get in touch with us regarding this.
What connectivity options are available for the software control system on the Tetra 1000 system?
With its full PC control system, the Tetra 1000 plasma system from Diener electronic offers the following connection options, such as:
- higher-level control systems, e.g. via Profinet
- MES systems, e.g. via OPC UA
- Database connection via ODBC
