The Tetra 320R production system with its chamber volume of 320 litres and PC control is used in series production (cleaning, etching and activation):
Technical data
Control cabinet: W 870 mm, H (with feet) 1860 mm, D 1400 mm
Chamber: ∅ 640 mm, D 1000 mm
Chamber volume: approx. 320 litres
Gas supply: 2 gas channels via MFCs
Generator: 1 pc. (80 kHz/ 1000 Watt)
Control: PC control (Windows)
Parts holding fixture: according to customer requirements
Plasma processes
Materials cleaning
Plasma technology offers solutions for any type of contamination, for any substrate and any post-treatment. In the process, molecular contamination residues are decomposed as well.
Activation of materials
Good wettability is a prerequisite for the adhesion of binding partners in painting, gluing, printing or bonding.
Etching materials
Plasma technology allows for anisotropic and isotropic etching. Isotropic etching is done by chemical etching and anisotropic etching by physical etching.
Coating of materials
With low-pressure plasmas, components can be tempered with various coats. This is done by supplying gaseous and liquid starting substances into the vacuum chamber.
