Tetra 45

LOW-PRESSURE PLASMA SYSTEMS (PLASMACLEANER)

The Tetra 45 plasma systems can be combined in different variants in a modular manner. Below, please find an overview over the most common options using the Tetra 45 plasma systems.

The chamber with 125 mm height and 572 mm width is particularly suitable for large-sized components. Since the chamber is made from aluminium extruded sections, the length can be flexibly adjusted.

Analytics (SEM, TEM)
Archaeology
Automotive
Life sciences
Elastomer technology
Electrical engineering
Electron microscopy
Precision engineering
Research and development
Semiconductor technology
Small batch production
Plastics Technology
Medical engineering
Micro-system technology
Solar cell technology
Textile technology

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Different models

Model 2

Model 2, standard system
BASIC PC control in basic unit type A
Vacuum chamber rectangular, aluminium, hinged door
(W: 572 mm x D 650 mm x H 125 mm)
Gas supply:
MFC

Model 3

Model 3, standard system
FULL PC control (Windows 10 IoT) in basic unit type A
(W 850 mm x D 800 mm x H 1,700 mm)
Vacuum chamber rectangular, aluminium, hinged door
(W: 572 mm x D 650 mm x H 125 mm)
Gas supply:
MFC

Model 5

Model 5, corrosive gas system (e.g. for fluorinated process gases)
BASIC PC control in basic unit type A
(W 850 mm x D 800 mm x H 1,700 mm)
Vacuum chamber rectangular, aluminium, hinged door
(W: 572 mm x D 650 mm x H 125 mm)
Gas supply:
MFC

Model 6

Model 6, corrosive gas system (e.g. for fluorinated process gases)
FULL PC control (Windows 10 IoT) in basic unit type A
(W 850 mm x D 800 mm x H 1,700 mm)
Vacuum chamber rectangular, aluminium, hinged door
(W: 572 mm x D 650 mm x H 125 mm)
Gas supply:
MFC

Plasma processes

Materials cleaning

Plasma technology offers solutions for any type of contamination, for any substrate and any post-treatment. In the process, molecular contamination residues are decomposed as well.

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Activation of materials

Good wettability is a prerequisite for the adhesion of binding partners in painting, gluing, printing or bonding.

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Etching materials

Plasma technology allows for anisotropic and isotropic etching. Isotropic etching is done by chemical etching and anisotropic etching by physical etching.

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Coating of materials

With low-pressure plasmas, components can be tempered with various coats. This is done by supplying gaseous and liquid starting substances into the vacuum chamber.

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Technical data

Basic equipment

Housing sizes vary depending on components/options
Chamber volume: Varies depending on chamber length
Voltage supply: 230 V or 400 V / 3 phases

Gas supply

Mass flow controllers (MFCs)

Vacuum chambers

Stainless steel rectangular, hinged door (approx. W 572 mm, H 125 mm, depth variable)

Charge

Product carriers (optionally: water-cooled), aluminium plate, stainless steel plate

Controls

Basic PC control (Microsoft Windows CE)
Full PC control (Microsoft Windows 10 IoT)

Pressure measurement

Pirani
Capacity pressure gauge (for corrosive gas version)

Timer

Digital

Generators

Frequencies:

80 kHz: power 1000 W or 3000 W
13.56 MHz: power 0 - 300 W; 0 - 600 W
2.45 GHz: power 0 - 600 W; 0 - 1200 W

All generators are infinitely adjustable from 0 - 100%

Vacuum pumps

In different sizes and from different manufacturers (if required with activated carbon filter)

Additional options

Spare parts kit, pressure gauge, corrosive gas design, gas bottles, pressure reducer, heater plate, temperature display, heatable chamber, Faraday box, plasma polymerisation accessories, test inks, oxygen generator, slow ventilation, slow pump-off, maintenance/service, documentation in local language, installation on site incl. training. Further options available on request

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