Low-Pressure PlasmaPlasma system Tetra 45
Flat vacuum chamber for efficient plasma surface treatment of large workpieces
With its exceptional vacuum chamber and a chamber volume of 46 litres, the system offers ideal conditions for plasma cleaning, surface activation, plasma etching and plasma coating
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Optimised for large workpieces
The Tetra 45 is characterised by its flat vacuum chamber, which measures 125 mm in height, 572 mm in width and 650 mm in depth. This design enables the efficient processing of large-surface-area workpieces, assemblies and substrates, which can only be processed to a limited extent in conventional chambers.
The chamber consists of a high-quality extruded aluminium profile. This allows its length to be flexibly adapted to specific requirements. Thanks to its modular design, the Tetra 45 can be individually tailored to different process requirements and flexibly integrated into industrial manufacturing processes. Various control options, process modules and equipment variants enable a bespoke solution for reproducible and documentable plasma processes.
The system is suitable for cleaning, activation, etching and functionalisation of a wide variety of surfaces and supports downstream processes such as bonding, painting, coating or printing.
Cleaning
The Low-Pressure Plasma system Tetra 45 offers solutions for ultra-precise cleaning of all surfaces, for every substrate, and for every post-treatment process. Plasma cleaning removes all organic residues without subjecting the component to chemical or thermal stress.
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Activation
Good surface wettability is a prerequisite for the adhesion of bonding partners during painting, gluing, printing, or bonding. Plasma activation using the Low-Pressure Plasma Tetra 45 system creates polar bonding partners and increases the surface energy.
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Coating
The Low-Pressure Plasma Tetra 45 system can also modify surfaces by applying a coating. Plasma coating can be used to deposit hydrophobic, hydrophilic, protective, or insulating layers of any kind.
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Etching
The plasma technology of the Low-Pressure Plasma Tetra 45 system enables anisotropic and isotropic etching. This results in the nanostructuring of surfaces, which increases their surface area and improves adhesion.
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46l chamber
The Low-Pressure Plasma Tetra 45 system is equipped with a chamber volume of 46 litres, which is ideally suited to large industrial components. The plasma system features an aluminium chamber, which ensures particularly safe and stable industrial processes. The narrow, rectangular design of the Tetra 45 enables the efficient processing of relatively flat, large-format components and ensures optimum utilisation of the chamber volume. The robust aluminium chamber is tailored to industrial requirements and is particularly suitable for reliable plasma processes in series production.
Electrode
As technology advances, so do the requirements. With Diener electronic, companies benefit from a high level of investment security, as the Tetra 45 system can be further developed to meet future requirements. Thanks to the flexible modular system, the choice of single- or multi-tier electrodes depends on the specific application. For complex, larger components that take up a lot of space in the chamber, the installation of a single electrode is recommended to ensure uniform treatment. To ensure uniform treatment in every application of the Tetra 45 plasma system, a two-tier electrode is installed when there are many small components arranged across several tiers.
Industry 4.0
To meet the growing demands of Industry 4.0, Diener electronic offers the Tetra 45 plasma system with an optional automatic door. This allows the Tetra 45 plasma system to be quickly integrated into an MES and optimally incorporated into automated production lines. The option of automated loading and unloading reduces the need for manual intervention, thereby increasing process reliability and enabling reproducible processes. Through automation, the Tetra 45 plasma system ensures efficient quality control.
Control
For industrial applications of the Tetra 45, the control unit is best suited to a simpler, Low Cost or basic PC control system with pre-set processes. For demanding production environments, a full PC control system is available. This provides process archiving, alarm logs, remote diagnostics and network connectivity. Efficient and cost-effective production is based on process transparency and traceability.
Technical data
Housing dimensions
Standalone
Control unit
Low Cost PC (Windows CE)
Basic PC (Windows CE)
Full PC (Windows 11 IoT Enterprise)
Vacuum chamber
Aluminium,
W 572 mm x H 125 mm x D 650 mm; Volume approx. 46 liters
Generator
80.00 kHz | Power output 0 - 1000 W
80.00 kHz | Power output 0 - 3000 W
100.00 kHz | Power output 0 - 500 W
13.56 MHz | Power output 0 - 300 W
2.45 GHz | Power output 0 - 850 W
Gas supply
MFC (Mass flow controller)
Electrode
Single-tier electrode
Multi-tier electrode
RIE electrode
Pressure measurement
Pirani sensor
Capacity pressure gauge
Power supply
400 V | 16 - 125 A
Technical changes reserved.
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FAQ Frequently Asked Questions
What are the key benefits of the Tetra 45?
The Tetra 45 from Diener electronic is characterised by its shallow vacuum chamber with a small volume. It evacuates quickly, saving time and money. This makes it highly efficient and ideal for flat components.
Can ESD-sensitive components be handled using the Tetra 45?
Yes, this is possible using low-pressure plasma of the Tetra 45. A trial can be carried out in our process department on request.
Is the Tetra 45 plasma system suitable for continuous operation?
All standard and specialised systems for industrial use, such as the Tetra 45 from Diener electronic, are designed for continuous operation and are serviced at regular intervals by service engineers to ensure they remain in good working order.
Which surfaces can be activated using the Tetra 45 plasma system?
The Tetra 45 plasma system from Diener electronic can be used to activate the following surfaces: plastics, metals, glass, ceramics and textiles.
Is there an alternative to hydrogen in the Tetra 45 system?
Upon request to Diener electronic, a hydrogen generator or water vapour may be considered as an alternative to hydrogen for the Tetra 45 system.
What is the typical process temperature for the Tetra 45 in the vacuum chamber?
With the Tetra 45 from Diener electronic, the temperature is normally between room temperature and approximately 80 °C – depending on the component, chamber type, process time and load quantity. Higher temperatures can be achieved on request from Diener electronic using heating elements.
What is the typical pressure range usually found in the vacuum chamber of the Tetra 45?
The typical pressure range of the Tetra 45 is adjustable from 0.1 to 1.0 mbar, depending on the defined low-pressure plasma process.
Which gases can be used with the Tetra 45?
The following gases can be used in the Tetra 45 and, more generally, in low-pressure plasma: O₂, N₂, Ar, ambient air, CO₂, H₂O vapour and forming gas
How much can be applied using the Tetra 45 system during coating?
The Tetra 45 system from Diener electronic can be used to apply a coating down to the lower micrometre range (< 1 micrometre).
What connectivity options are available for the software control system on the Tetra 45 system?
With its full PC control system, the Tetra 45 plasma system from Diener electronic offers the following connection options, such as:
- higher-level control systems, e.g. via Profinet
- MES systems, e.g. via OPC UA
- Database connection via ODBC
