Physical vapour deposition process which, in contrast to the chemical vapour deposition (CVD) does not use any chemical reactions. It is often used for vapour deposition of hard coatings on metals. In many cases, the material to be deposited is thermally evaporated. Furthermore, the material to be deposited can also be transferred to the vapour phase by sputtering in the low-pressure plasma. in die Dampfphase überführt werden. In this process, the "target", the material to be deposited, is bombarded withions,breaking atoms off the target.