Physical vapour deposition (PVD)

Physical vapour deposition process which, in contrast to the chemical vapour deposition (CVD) does not use any chemical reactions. It is often used for vapour deposition of hard coatings on metals. In many cases, the material to be deposited is thermally evaporated. Furthermore, the material to be deposited can also be transferred to the vapour phase by sputtering in the low-pressure plasma. in die Dampfphase überführt werden. In this process, the "target", the material to be deposited, is bombarded withions,breaking atoms off the target.

back to glossary

+49 7458 99931-0

Get an expert on the phone

info@plasma.com

Write us what we can do for you

Request a quotation

You know exactly what you’re looking for