Plasma technology offers solutions for any type of contamination, for any substrate and any post-treatment. In the process, molecular contamination residues are decomposed as well.
Plasma technology allows for anisotropic and isotropic etching. Isotropic etching is done by chemical etching and anisotropic etching by physical etching.
With low-pressure plasmas, components can be tempered with various coats. This is done by supplying gaseous and liquid starting substances into the vacuum chamber.
