Physical vapour deposition process (PVD process)

The process is primarily carried out in the argon plasma. In the physical vapour deposition process by means of plasma technology, the material to be deposited is mounted on the working electrode of the reactor as a solid sample. When this working electrode is capacitively separated from the generator, it is increasingly charged by electron bombardment. The argon ions are accelerated by the negative electrode and collide with the target. There, atoms are broken off the surface and transferred to vapour phase. Physical vapour deposition process which, in contrast to the chemical vapour deposition (CVD), does not use any chemical reactions. It is often used for vapour deposition of hard coatings on metals. In many cases, the material to be deposited is thermally evaporated. Furthermore, the material to be deposited can also be transferred to the vapour phase by sputtering in the low-pressure plasma. in die Dampfphase überführt werden. In this process, the "target", the material to be deposited, is bombarded with ions so that atoms are broken off the target.