PlasmaBeam and Plasma APC 500

The processes of ultra-fine surface cleaning and activation can be carried out by the reaction with the active gas jet containingreactive particles (radicals). In addition, loose, adherent particles are removed from the surface by the compressed air accelerated active jet of gas.

PlasmaBeam and Plasma APC 500 are suitable aspretreatment devices for the following processes:

  • Gluing
  • Bonding
  • Printing
  • Lining
  • Soldering
  • Welding

of the following surfaces: Plastic, metal*, glass, ceramics, and hybrid materials.

*PlasmaBeam only.
The Plasma APC 500 is only used for non-conductive surfaces.

The active gas jet, which comes from the plasma nozzle is always freeof HV potential. This permits the use of the device for various processes in the electronics industry, such as:

  • Bond pad cleaning before wire bonding
  • LCD contact cleaning and activation prior to heat-seal bonding
  • Activation of chip surfaces before printing

Surface treatment with the PlasmaBeam and Plasma APC 500 must always be performed while moving. The treatment speed (V) and distance between the plasma nozzle and surface to be treated (D) are the most important parameters for achieving the desired surface properties. Changes of these parameters can drasticallychange the pretreatment effect.

The Plasma APC 500 is used for non-conductive surfaces.