Low-pressure plasma

Low-pressure plasma offers very versatile options to modify surfaces. Precision cleaning of contaminated components, the plasma activation of plastic parts, etching of PTFE, silicon and coating of plastic parts with PTFE-like films are among the applications. In this respect, low-pressure plasma is used in many different areas where it is important to bond materials together, or to change the surface properties to suit your needs.

In the low-pressure plasma technology, gas is excited in a vacuum by supplying energy. This results in energetic ions and electrons, as well as other reactive particles, which constitute the plasma. Surfaces can then be effectively altered. There are three plasma effects:

Micro-sandblasting: The surface is removed by the ion bombardment.

Chemical reaction: Chemical reaction of the ionized gas with the surface.

UV radiation: UV radiation breaks down long-chain carbon compounds.

The effect of the plasma changes by varying the process parameters such as pressure, power, process time, gas flow and composition. Several effects can therefore be achieved in a single process step.