Thermal process to connect metallic or metal coated components by using a metal or metallic alloy adhering to both partners as a connecting agent, designated solder.

The solder has lower melting point than both of the partners to be connected, so that, opposite to a welding process, during the soldering process, none of the partners will be melted.

In general the quality of the soldering contact can be significantly improved by removing surface oxydes. This can be achieved either by using a fluxing agent or by a prior Plasma treatment favorably by a hydrogene plasma.

Glass and ceramics can be soldered it they have been metallized.

contact pins
Plasma treatment to remove oxidized surfaces prior to the soldering process not only improves the adherence but most particullarly the electric contact.