Transfering a geometrical layout to a substrate using a mask which is produced out of a foto resist, The fotoresist which may be a positive resist or a negative resist is deposited on the substrate to be structured. The geometrical structure is transfered to the foto resist by light or UV illumination. The development process removes the foto resist from the areas which have been exposed to irradiation (positive resist) or from the areas which have not been exposed (negative resist).

The substrate is only treated by the subsequent anisotropic plasma etching process (Ion Etching, RIE) where the fotoresist has been removed.