Technology to electrically connect components in the semiconducter and microelectronic industry. Different from solding wire bonding does not require any additional contacting material. High frequency friction provokes microwelding of the contact area and welding adhesion.
Wire bonding is a most essential application for plasma treatment:
- It only works if the substrate is absolutely clean and all separating agents are removed.
- Oxidized surfaces prevent from proper bonding and also from proper electric contact. Therefore Plasma treatment is applied to remove oxide layers.