Thermal process for positive substance joining of metallic or metallized bonding partners using a metal or an alloy as a bonding agent. The melting temperature of the bonding agent is lower than that of the bonding partners, so that the bonding partners are not liquefied during the soldering process, in contrast to welding.
Usually, oxide layers must be removed on the bonding partners to achieve perfect bonding. They can be removed by means of flux agents or upstream plasma cleaning. erfolgen. Also glass or ceramics can be soldered after previous metallising. wird.