Bonding is becoming increasingly important, especially in electronics, as an inexpensive joining technology, and starting with the ban on lead-containing solders also as an alternative to soldering technology. Adhesive surfaces require preparation to ensure reliable surface wetting by the liquid adhesive and secure adhesion of the adhesive after curing. Preparing a surface for bonding can improve bonding. This is done by brushing, grinding or blasting (mechanical surface pretreatment) and wet chemical cleaning with organic solvents or water with surfactants. In a subsequent pre-treatment by plasma processes, oxygen atoms are built into the surface and thus the surface tension is increased. This results in better wettability of the adhesive. The bond can thus be reinforced, has a higher strength and improved resistance to ageing.

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